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3D Printing of Copper and Copper Alloys

We manufacture components from our own gas atomized materials using the latest additive manufacturing technologies.

Basic Properties of Used Materials

Please note that properties can vary significantly for specific geometries, heat and surface treatments.

* in preparation

Material
Layer
Heat Treatment
Electrical Conductivity (IACS)
Thermal Conductivity
Density
Applications
Pure Copper
20 Microns
Without HT
96-100% IACS
401 W/(m*K)
≥ 8.90 g/cm³
Contacts, Inductors, Atennas, Coolers
CuCr1Zr*
40 microns
Heat Treatment
Better than 80%
320 W/(m*K)
≥ 8.90 g/cm³
Nozzles, Contacts, Coolers
Pure Copper*
40 mcirons
Without HT
97-101% IACS
401 W/(m*K)
≥ 8.90 g/cm³
Combustion Chambers, Heat Exchangers, Coolers
CuCr1Zr*
80 Microns
Heat Treatment
Better than 80%
320 W/(m*K)
≥ 8.90 g/cm³
Combustion Chambers, Heat Exchangers
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